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SAFE™ OSAT Alliance SAFE™ OSAT Alliance SAFE™ OSAT Alliance One-stop Advanced AI Solutions One-stop Advanced AI Solutions One-stop Advanced AI Solutions


With more than 30 years of collaboration with professional OSAT1 partners, we offer advanced, customized, and innovative 2.5D/3D packages.
By combining the expertise of Foundry and Memory into one team, customers have successfully unleashed innovations to create premier
all-in-one solutions for the AI era.

1OSAT: Outsourced Semiconductor Assembly and Test.
Business
Areas Business
Areas Business Areas

• Bumping / EDS (Electrical Die Sorting)
• Packaging Assembly (FCBGA/FCFBGA/LGA, FOWLP/FIWLP, Leadframe Package, etc.)
• Packaging Test (Automotive, SoC, RF, PMIC, etc.)

SAFE™ OSAT Alliance Competitiveness SAFE™ OSAT Alliance Competitiveness SAFE™ OSAT Alliance Competitiveness
Competitiveness icon 1

Collaborating with SAFE™ OSAT Alliance partners provides customized services that meet the diverse needs of customers in the AI era, which is especially helpful given the increasing number and complexity of tests.

Competitiveness icon 2

Integrating the synergies of Samsung’s Foundry, Memory, and advanced packaging capabilities enable optimized supply chain management (SCM), offering improved product Time-to-Market (TTM)2 cycle to customers.

2Compared to when a fabless customer uses different foundry, memory, and package companies, this collaboration reduces time to market — from chip development to production — by approximately 20%.
Competitiveness icon 3

One-stop packaging solutions optimize performance, quality, and cost to customers’ products. 

 

 

SAFE™ OSAT Alliance Partners SAFE™ OSAT Alliance Partners SAFE™ OSAT
Alliance Partners
ALT
Amkor
ASE
Doosan Tesna
Furex
Hana Micron
LB Semicon
Nepes
SFA
Signetics
STATSChipPAC
STECO

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