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SAFE™ OSAT Alliance SAFE™ OSAT Alliance SAFE™ OSAT Alliance One-stop Advanced AI Solutions One-stop Advanced AI Solutions One-stop Advanced AI Solutions


With more than 30 years of collaboration with professional OSAT1 partners, we offer advanced, customized, and innovative 2.5D/3D packages.
By combining the expertise of Foundry and Memory into one team, customers have successfully unleashed innovations to create premier
all-in-one solutions for the AI era.

1OSAT: Outsourced Semiconductor Assembly and Test.
Business
Areas Business
Areas Business Areas

• Bumping / EDS (Electrical Die Sorting)
• Packaging Assembly (FCBGA/FCFBGA/LGA, FOWLP/FIWLP, Leadframe Package, etc.)
• Packaging Test (Automotive, SoC, RF, PMIC, etc.)

Competitiveness icon 1

Collaborating with SAFE™ OSAT Alliance partners provides customized services that meet the diverse needs of customers in the AI era, which is especially helpful given the increasing number and complexity of tests.

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Integrating the synergies of Samsung’s Foundry, Memory, and advanced packaging capabilities enable optimized supply chain management (SCM), offering improved product Time-to-Market (TTM)2 cycle to customers.

2Compared to when a fabless customer uses different foundry, memory, and package companies, this collaboration reduces time to market — from chip development to production — by approximately 20%.
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One-stop packaging solutions optimize performance, quality, and cost to customers’ products. 

 

 

SAFE™ OSAT Alliance Partners SAFE™ OSAT Alliance Partners SAFE™ OSAT
Alliance Partners
ALT
Amkor
ASE
Doosan Tesna
Furex
Hana Micron
LB Semicon
Nepes
SFA
Signetics
STATSChipPAC
STECO