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The Future of Automotive,
Defined by Foundry

A car with glowing headlights in a futuristic purple-lit setting

The automotive industry is undergoing its greatest change
in over 100-years and
Samsung Foundry is in a unique position to lead the transformation with its chip production capabilities.
We’re committed to driving innovation by developing and mass-producing chips needed for the future of
mobility.

Automotive Innovation
for
the Road Ahead

Technical 3d illustration of car with x-ray effect
PMIC/BMIC

Power Management System/
Supply,

Battery Management System

Processors for
In-vehicle Infotainment

Integrated Center Stack,
Instrument Cluster,
Telematics, IVI Domain Controller

Processors & Sensors
for ADAS/AD

Camera Module, Radar Module, LIDAR & Laser Module, V2X,
ADAS Domain Controller

MCU

Engine Management System, Motor Controller, Battery Management System,
Zonal Controller

Expert designing the driving experience of tomorrow
Processors for
In-Vehicle Infotainment

To bring the next-level of driving experience to life,
Samsung Foundry is mass-producing IVI solutions for customers using 14nm, 8nm, and
5nm process technologies.

four arrows facing up envisioning the enhanced power solutions
PMIC/BMIC

For enhanced power solutions, Samsung Foundry is manufacturing a specialized 8-inch PMIC product wafer.

a sketch revealing the future autonomous cars
Processors &
Sensors for ADAS/AD

As with IVI solutions, Samsung Foundry is manufacturing 14nm, 8nm, and 5nm products. Furthermore, we plan to expand auto grade support from AG2 to AG1 for select processes, like 8nm and 5nm. We’re also developing more advanced nodes for ADAS products requiring higher processing performance, like 4nm and
2nm. With these solutions, we are ready to enable customers to lead the future of autonomous driving.

advanced memory technology for mcu customers
MCU

Samsung Foundry is enabling MCU customers with 28nm embedded non-volatile memory (eNVM) technologies (embedded Flash and embedded MRAM). In addition, a FinFET-based eMRAM will
be offered.

A Clear Path
for the New Era
of Automotive

Building on an extensive track record,
Samsung Foundry continues to refine a comprehensive, innovation-based
roadmap
that will define the future of mobility.
These plans include technologies that will
perform both at a higher level and at increasing efficiency, thanks to
the development of advanced technologies for our automotive processes.

Advanced Technologies Now
— and in the Future

For auto grade processes, Samsung Foundry already offers 14nm Logic chips and 28nm eFlash eNVM chips at AG1, and SF5A and 8nm Logic chips at AG2. In the coming years, we expect to bring SF4A and even SF2A chips to the market. Furthermore, we will complete 14/8/5nm eMRAM process development.

Process Available 2023 2024 2025 2026
Logic
SF2A
SF4A
SF5A SF5A
8nm 8nm
14nm
eNVM
8nm eMRAM
14nm eMRAM
28nm
eFlash 		Auto, G2 Auto, G1
A Superior 8-inch Process
for Automotive

Power management is a key aspect of contemporary automotive solutions.
To this end, Samsung Foundry provides BCD
Power IC in 130nm 1.5 / 3.3 / 5 / 7’’ 70V / eFlash. There are also plans to release 130nm 100V BCD, 90nm 70V BCD, and +DTI in the coming years.

For eFlash, we will soon offer 1.2V, ESF3.

Available
Now 		2023 2024 2025
BCD
Power IC
130nm 1.5/
3.3/ 5/ 7~70V/
eFlash 		130nm
100V BCD 		+DTI
90nm 70V BCD
eFlash
eFlash (1.2V, ESF3) Auto, G1
Total Design Solutions
for Automotive

Customers are prepared for the future with Samsung Foundry’s automotive IP and design infrastructure. In addition to dedicated programs for automotive customers, we provide a 14nm process that supports AG1 as well as 8nm & 5nm processes that support AG2. Our offerings go beyond interface IPs with analog and security IPs for these processes as well. For chiplet solutions, D2D IPs like UCIe are being developed in 8nm and 5nm.

Enabling Next-Level Automotive Design

Kick off your next generation automotive design with Samsung Foundry’s strong technical foundation; design in confidence with IP covering Analog, Memory Interface, High-Speed Interface, and Security; in addition, automotive-hardened IP-ready support for 14nm AG1, 8LPU AG2, and SF5A AG2. Design infrastructure readiness is now available for 14nm, 8nm, and SF5A Technology, Design Collateral, and Foundation IPs. For enhanced quality and reliability, we offer AEC-Q100-aware sign-off, DFT & Zero DPPM as well as advanced functional safety
for design methodology.

IP Readiness
IP

Category 		IP List 14nm AG1 8nm
AG2 		SF5A AG2
Analog
IP
PLL / OSC
Temp
Sensor
ADC
Memory Interface
IP 		LPDDR4X/
5/5X
High speed
Interface IP High-
speed
Interface
IP
MIPI-C/D
MIPI-M
USB
PCIe
Security
IP 		PUF / TRNG
D2D UCIe -
Available
Under Development
Design Infra Readiness
Item 14nm 8nm SF5A
Technology Tech-nology
Process Qual
AEC-Q100 Grade 1 Grade 2 Grade 2
Automotive Service Package
Design
Collateral
Low DPPM Design
Rules
SPICE
Model
Aging
Model
EM Rules
Latchup &
ESD Rules
Foundation
IPs
ISO 26262 Assessment ASIL B ASIL D ASIL D
Si
Validation
Available
Item Status
AEC-Q100-aware
Sign-off AEC-
Q100-
aware
Sign-off
Automotive
Sign-off Guide
Thermal-aware EM &
SEB / Redundancy-aware
EM
Aged Library Characterization & STA
DFT &
Zero
DPPM
Boundary Scan
IDDQ Testing
Cell-aware Fault Model
Memory & Logic BIST / Power-On Self-Test
Functional
Safety
Fault Injection
Simulation / FMEDA
Safety Mechanism
Insertion & Implementation
SER Analysis
Safety Format-driven Implementation & Verification Flow Long-
term*

* Can be flexible according to IEEE P2851 standardization schedule

A Fully Certified Design Platform

Samsung Foundry provides automotive solutions certified for high quality, reliability, safety, and security. To ensure high quality, Wafer-Level Reliability and AEC-Q100 Grade 1 for IP/
Packaging with Auto Grade
2/1 are available.
For quality management, our auto service package is IATF 16949-certified by ASP Automotive, ensuring a high standard of excellence.
We’ve earned the ISO 26262 functional safety
standard and are ASIL-B assessment ready.
And for security, we offer complete and configurable IPs for all EVITA security levels.

Samsung Logo
  • AEC-Q100
    Reliability

    Wafer Level Reliability

    AEC-Q100 Grade 1,

    IP/Packaging Grade 2/1 available

    Qualified mark
  • ISO 26262
    Functional Safety

    ISO26262 functional safety ASIL-B assessment ready

    Certified mark
  • Auto

    Service Package
    Quality Management

    IATF 16949 certified

    ASP ensuring automotive quality

    Certified mark
  • Auto
    Security
    Automotive Security

    Complete and configurable IP

    for all EVITA security levels

    Certified mark

Automotive
Packaging
Technology

Sleek vehicle with ambient purple lighting.
  • Resists Thermal Extremes

    Reliability in even

    the most challenging temperatures

  • Avoids Electromagnetic Interference

    Immunity shielding to enable

    consistent performance

  • Withstands Constant Vibration

    Durability to last for 15+ years

    under demanding conditions

Enhanced Packaging
for Diverse Applications

Robust packaging is essential in the harsh environments of automotive ICs. Our innovative packaging technology overcomes the challenges of thermal extremes, electromagnetic interference, and constant vibration over the expected 15-year life of a vehicle.

  • WLP automotive package type WLP Grade 3
  • FOWLP automotive package type FOWLP Grade 3
  • WB-FBGA package technology WB-FBGA Grade 3
  • FC-FBGA package technology FC-FBGA Grade 3
  • FC-PBGA package technology FC-PBGA Grade 3
  • MCM package technology MCM Grade 3

A Comprehensive
Packaging Portfolio

We support numerous automotive package types including wafer-level packaging (WLP/FOWLP), ball-grid-array packaging (FBGA, PBGA,FC-FBGA, FC-PBGA), lead-frame packaging, and module packaging.

SAFE™ Partners

Through partnerships with key industry leaders,
Samsung Foundry’s automotive IP has earned
ASIL & AEC-Q100 qualifications.