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Samsung CXL® Memory
Solutions
Samsung CXL® Memory
Solutions
Samsung CXL® Memory Solutions

Revolutionize your data center's memory capabilities with Samsung's cutting-edge CXL® solutions. Leveraging the power of CXL®, an open standard interface that establishes high-speed, low-latency1 connections between processors and devices, Samsung offers innovative products designed to expand memory capacity and memory bandwidth beyond traditional DDR channels.

Revolutionize your data center's memory capabilities with Samsung's cutting-edge CXL® solutions. Leveraging the power of CXL®, an open standard interface that establishes high-speed, low-latency1 connections between processors and devices, Samsung offers innovative products designed to expand memory capacity and memory bandwidth beyond traditional DDR channels.

Revolutionize your data center's memory capabilities with Samsung's cutting-edge CXL® solutions. Leveraging the power of CXL®, an open standard interface that establishes high-speed, low-latency1 connections between processors and devices, Samsung offers innovative products designed to expand memory capacity and memory bandwidth beyond traditional DDR channels.

  • Capacity
    Expansion

    Up to 50%2 higher
    total memory capacity
    compared to RDIMM only

  • Bandwidth
    Expansion

    Up to 100%2 greater
    total memory bandwidth
    compared to RDIMM only

  • Memory
    Pooling

    Maximize memory utilization
    across multiple hosts

1 Similar to the latency of 1 NUMA hop.
2 Memory capacity & bandwidth values based on 16 DDR5 memory DIMM slots and 64 CXL® lanes.
CMM-D CMM-D CMM-D

CMM-D is a CXL® Memory Module built with Samsung's DRAM technology. CMM-D allows for easy and efficient scaling of memory as needed. This maximizes performance for data-intensive workloads, and ensures it can adapt to future computing demands. 

CMM-D is a CXL® Memory Module built with Samsung's DRAM technology. CMM-D allows for easy and efficient scaling of memory as needed. This maximizes performance for data-intensive workloads, and ensures it can adapt to future computing demands. 

CMM-D is a CXL® Memory Module built with Samsung's DRAM technology. CMM-D allows for easy and efficient scaling of memory as needed. This maximizes performance for data-intensive workloads, and ensures it can adapt to future computing demands. 

Samsung CMM-D with its black casing lifted, exposing the precision-engineered circuit board and memory chips.
The Samsung CXL Memory Module DRAM with its slim black design.
What is Compute
Express Link (CXL®)?
What is Compute
Express Link (CXL®)?
What is Compute Express Link (CXL®)?

An open standard developed through the CXL® Consortium,
CXL® is a high-speed, low-latency CPU-to-device interconnect technology built on the PCIe physical layer. CXL® provides efficient connectivity between the host CPU and connected devices such as accelerators and memory expansion devices.

An open standard developed through the CXL® Consortium,
CXL® is a high-speed, low-latency CPU-to-device interconnect technology built on the PCIe physical layer. CXL® provides efficient connectivity between the host CPU and connected devices such as accelerators and memory expansion devices.

An open standard developed through the CXL® Consortium,
CXL® is a high-speed, low-latency CPU-to-device interconnect technology built on the PCIe physical layer. CXL® provides efficient connectivity between the host CPU and connected devices such as accelerators and memory expansion devices.

Samsung Develops Industry's First CXL®
DRAM Supporting
CXL 2.0
Samsung Develops Industry's First CXL® DRAM Supporting CXL 2.0 Samsung Develops Industry's First CXL® DRAM Supporting CXL 2.0

128GB DRAM based on advanced CXL® 2.0 interface to accelerate commercialization of next-generation memory solutions.

128GB DRAM based on advanced CXL® 2.0 interface to accelerate commercialization of next-generation memory solutions.

128GB DRAM based on advanced CXL® 2.0 interface to accelerate commercialization of next-generation memory solutions.

Samsung CXL Memory Module DRAM with the black ridged casing offset to reveal the internal circuit board and memory chips.
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