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Package Turnkey Service

Full turnkey
packaging service
Go end to end

Samsung handles the chip packaging process from end-to-end with turnkey packaging services, bringing precision to every step of the process and optimizing your product cycles.

Our customers create products that change the world. In order to power those breakthroughs, they need a range of Advanced Packaging solutions, targeting optimized system performance to cost-effective chip integration solutions—all tailor made for their products.
Samsung’s turnkey packaging services deliver precision at every stage of the chip making process from innovative fabrication and packaging to extensive PSI and Multiphysics reliability testing.
From Memory Integration that creates lightning-fast synergy between logic and memory to Advanced Packaging designs that breakdown barriers in power and efficiency, Samsung offers leading edge solutions in heterogeneous integration, 2.5D and 3D die stacking, and more.

And with an extensive ecosystem of OSAT partners and PCB suppliers, Samsung helps its foundry customers fast track the packaging process, so they can shorten product turnaround times while meeting the high-speed performance goal of today’s markets.

Multiphysics Simulation + Design Optimization

Intuitive solutions tackling high power, high-bandwidth and multi-die design for 2, 2.5, 3D and their hybrid architectures.
Exploring thermal, electrical and mechanical analysis and testing, calibrated to give the high reliability at peak levels of performance.

Advanced design solutions for realizing high performance
I-Cube™, H-Cube™, and X-Cube™ Systems

Advanced design solutions for realizing high performance I-Cube™ & X-Cube™ Systems

Advanced design solutions for realizing high performance
I-Cube™ & X-Cube™ Systems

Advanced design solutions for realizing high performance I-Cube™ & X-Cube™ Systems

Advanced design solutions for realizing high performance
I-Cube™ & X-Cube™ Systems

Advanced design solutions for realizing high performance I-Cube™ & X-Cube™ Systems
1

High-power PI solution

2

Thermal design optimization

3

High speed die-to-die interface IP
HBM3 interface IP + Power efficient
die-to-die IO for 3D

4

Efficient multi-die design analysis

5

Area/Power overhead impact analysis

6

Power efficient die-to-die IO for 3D

Total Packaging Service of

Design, Assembly, and Testing

A total design solution with services and tools to create the system that works for you. From chip to board, everything is intricately bundled to meet and exceed industry standards with the latest advanced packaging designs including SiP, 2.5D and 3D.

Fully-covered total packaging service

Fab

Fully-Covered total packaging turnkey service step 4 - 1. Fab

Logic

Interposer

Si-Capacitor

Bump

Fully-Covered total packaging turnkey service step 4 - 2. Bump

C4 Bump

Cu Pillar

uBump

Package

Fully-Covered total packaging turnkey service step 4 - 3. Package

Postfab

Assembly

Test

Fully-Covered total packaging turnkey service step 4 - 4. Test

Wafer Test

PKG Test

Fully-Covered total packaging service

Fab

Fully-Covered total packaging turnkey service step 4 - 1. Fab

Logic

Interposer

Si-Capacitor

Bump

Fully-Covered total packaging turnkey service step 4 - 2. Bump

C4 Bump

Cu Pillar

uBump

Package

Fully-Covered total packaging turnkey service step 4 - 3. Package

Postfab

Assembly

Test

Fully-Covered total packaging turnkey service step 4 - 4. Test

Wafer Test

PKG Test

Fully-Covered total packaging service

Fab

Logic

Interposer

Si-Capacitor

Fully-Covered total packaging turnkey service step 4 - 1. Fab

Bump

C4 Bump

Cu Pillar

uBump

Fully-Covered total packaging turnkey service step 4 - 2. Bump

Package

Postfab

Assembly

Fully-Covered total packaging turnkey service step 4 - 3. Package

Test

Wafer Test

PKG Test

Fully-Covered total packaging turnkey service step 4 - 4. Test

Advantages & benefits

Memory Integration

Synergy between
Memory & Logic

Advantages & benefits of package turnkey survice - 1. Memory Integration

Faster TAT & FA

  • Reducing the lead-time
    through simple SCM
  • Faster Failure Analysis by rich integration experience
  • Faster product bring-up

Advanced Package

Leading edge package

Advantages & benefits of package turnkey survice - 2. Advanced package

Better Performance

  • Various PKG Solutions by
    customer
    demands

    (I-Cube™, X-Cube™, H-Cube™…)
  • Optimized Package Solution

    by Chip/PKG co-design in
    early stage
  • High-power PI Solution
    (Ultra-high density Cap:
    MIM, ISC)

Eco-System

Complete SCM control

Advantages & benefits of package turnkey survice - 3. Eco-System

Strong Eco-System

  • Enable In-house as well as
    OSAT
    • - Amkor, JCET, ASE-Kr,
      Hana-micron
  • SCM control including
    PCB Supplier
    • - Pre-booking PCB capacity by
       LTA(Long-term agreement)

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