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  • Advanced Package
    Advanced Package
    Advanced
    Package

    Samsung Foundry Advanced Package

More chips are better as one,

Advanced Heterogeneous Integration

Advanced Heterogeneous Integration brings the best of today’s chips to bear in one unified system – bringing power and diversity for a chipset that’s deeply efficient, highly adaptable, and simpler for production.

2.5D Package: I-Cube™ & H-Cube™

I-Cube™ deploys parallel horizontal chip placement to boost performance while combating heat build-up. Samsung’s Through Silicon Via ( TSV ) and Backend-of-the-line ( BEOL ) technologies form a foundation for two or more chips to harmonize their specialized functions, becoming more than the sum of their parts to deliver powerful solutions for modern devices. I-Cube™ is available in I-CubeS™ and I-CubeE™ derivatives based on the interposer type.

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I-Cube™

H-Cube™

3D IC: X-Cube™

3D IC packages boost performance even further by using much shorter interconnect wire lengths by stacking components vertically, enabling ultra-high vertical interconnect density with lower parasitics while saving massive amounts of on-chip real estate. 3D IC: X-Cube™ technology dramatically reduces yield risks from large monolithic dies, with 3D Integration that enables high system performance with lower cost while retaining high bandwidth and low power.

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3D IC: X-Cube™

Package Turnkey Service

Build your way with end-to-end packaging solutions

Your products are as unique as the chips that power them. Samsung Foundry delivers precision at every stage of the chip making process. With end-to-end solutions, it brings your chip design to life from design to fabrication and packaging, and all the way to testing.

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Performance & power optimized technologies for
monolithic or heterogeneous designs

Design
Enablement

Rich Eco-System of
High-Performance IP

Advanced Process
Technology

Advanced
Packaging

Economies of scale & scope
built on flexible business models combine with platform
to create integrated solutions

Spec

Design & Integration

FAB

Assembly & Test

Explore more about Advanced Package

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