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  • New potential
    breakthrough memory
    New potential
    breakthrough memory
    New potential
    breakthrough memory

    Graphical Image describing HBM2 Aquabolt is put on electrical circuit

Accelerating the tech frontier
Accelerating the tech frontier
Accelerating the tech frontier

From next-generation supercomputing to AI and graphic intensive technologies, the state-of-the-art 8 GB HBM2 Aquabolt from Samsung is high-bandwidth memory meticulously designed to dramatically increase performance and reduce power consumption form its predecessor HBM2 Flarebolt. From next-generation supercomputing to AI and graphic intensive technologies, the state-of-the-art 8 GB HBM2 Aquabolt from Samsung is high-bandwidth memory meticulously designed to dramatically increase performance and reduce power consumption form its predecessor HBM2 Flarebolt. From next-generation supercomputing to AI and graphic intensive technologies, the state-of-the-art 8 GB HBM2 Aquabolt from Samsung is high-bandwidth memory meticulously designed to dramatically increase performance and reduce power consumption form its predecessor HBM2 Flarebolt.

Layers of powerful performance

With just four Aquabolt packages in a system, performance can reach an astounding speed of 1.2 TB/s.
With the 20% performance improvement over legacy HBM2 product, Aquabolt delivers the highest 1024 I/O with 2.4 Gbps per pin speed
at 1.2V - making it the fastest data transmission speed for DRAM performance currently available from Samsung.
This powerful 307.2 GB/s data bandwidth allows for a nearly 10x faster data transmission than the 8 Gb GDDR5 chip.

SAMSUNG 2 HBM2 Aquabolts are put on an electronic circuit. One of them is hovered and it leaves graphic layers represent its connection between SAMSUNG HBM Aquabolt and device. 1.2 TB/s Astonishing Speed, 10x Faster than GDDR5
* Samsung HBM2 Flarebolt's performance: 2.0 Gbps at 1.35 V
* HBM2 - GDDR5 data transmission speed calculation

-8 GB HBM2 package's data bandwidth:
  2.4 Gbps per pin x 1024 bit bus = 307.2 GBps
  4 HBM2 package in a system:
  307.2 GBps x 4 = 1228.8 GBps = approximately 1.2 TBps
-8 Gb GDDR5 die's data bandwidth:
  8 Gbps per pin x 32 bit bus = 32 GBps

Optimized power efficiency

Enhanced to conserve energy, the innovative Aquabolt internal design reduces write power consumption by approximately 20%, interleave power by about 25% and read power usage by nearly 30% when compared to the previous generation.*

SAMSUNG HBM2 Aquabolt in form of dam is shown and the features of Aquabolt are represented as waterfall; 20% Less Write Power, 25% Less Interleave Power, and 30% Less Read Power.
* Tested internally on the HBM2 Aquabolt and HBM2 Flarebolt

Enhanced reliability

To reinforce thermal control and endurance, each cube of Aquabolt includes more thermal bumps than the previous HBMs and a new protective bottom layer to safeguard against errors and data loss that can be caused by pressure, shock, and particles from direct contact.

A clear layer comes out of SAMSUNG HBM2 Aquabolt and infographic describes the Protective Layer additionally covers Aquabolt.

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All product specifications reflect internal test results and are subject to variations by the user's system configuration

All product images shown are for illustration purposes only and may not be an exact representation of the product

Samsung reserves the right to change product images and specifications at any time without notice

For further details on product specifications, please contact the sales representative of your region.

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